I-DIN603 yentsimbi yentsimbi yebholithi yokuthwala intsimbi kunye ne nut

Inkcazelo emfutshane:

1. Umgangatho:DIN603, ASME B18.5
2. Ubungakanani: M5-M20;1/4″-1″
3. Ubude: 10mm-500mm
4. IBakala:8,8M
5. Marko:8,8M
6. Izinto eziphathekayo: insimbi engenasici
7. Gqibezela:kucacile
8. Ixesha lokuhambisa: Ngokwesiqhelo kwiintsuku ezingama-30-40.
9. Iphakheji: Iibhokisi & iipalethi okanye ngokwemfuno yomthengi.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Ibholithi yenqwelo kunye namantongomane
1.Umgangatho:DIN603, ASME B18.5
2.Ubungakanani:M5-M20;1/4″-1″
3.Ubude: 10mm-500mm
4.IBakala:8,8M
5.Marko:8,8M
6.Izinto eziphathekayo: intsimbi engenasici
7.Gqiba:kucacile
8. Ixesha lokuhambisa: Ngokwesiqhelo kwiintsuku ezingama-30-40.
9.Ipakethi: Iibhokisi kunye neepalethi okanye ngokwemfuno yomthengi.
Iimpawu zeMveliso:

I-DIN (1)

Unyango lomphezulu:
Mnyama
☆ Umnyama yindlela eqhelekileyo yonyango lobushushu besinyithi.Umgaqo-siseko kukwenza ifilimu ye-oxide kwindawo yesinyithi ukuhlukanisa umoya kunye nokufezekisa ukuthintela ukugqwala.I-Blackening yindlela eqhelekileyo yonyango lobushushu besinyithi.Umgaqo-siseko kukwenza ifilimu ye-oxide kwindawo yesinyithi ukuhlukanisa umoya kunye nokufezekisa ukuthintela ukugqwala.
Zinc
☆ I-Electro-galvanizing yitekhnoloji yonyango yentsimbi yesiko enikezela ukuxhathisa okusisiseko kwimigangatho yentsimbi.Iinzuzo eziphambili ziyi-solderability efanelekileyo kunye nokuchasana koqhagamshelwano olufanelekileyo.Ngenxa yeepropathi zayo ezilungileyo zokuthambisa, i-cadmium plating iqhele ukusetyenziswa kwinqwelomoya, kwi-aerospace, elwandle, nakwimveliso yerediyo neye-elektroniki.I-plating layer ikhusela i-substrate yentsimbi ekukhuselweni komatshini kunye neekhemikhali, ngoko ke ukuxhathisa ukubola kwayo kungcono kakhulu kune-zinc plating.
Hdg
☆ Iinzuzo eziphambili kukuthengiswa okulungileyo kunye nokuchasana koqhagamshelwano olufanelekileyo.Ngenxa yeepropathi zayo ezilungileyo zokuthambisa, i-cadmium plating iqhele ukusetyenziswa kwinqwelomoya, kwi-aerospace, elwandle, nakwimveliso yerediyo neye-elektroniki.I-plating layer ikhusela i-substrate yentsimbi ekukhuselweni komatshini kunye neekhemikhali, ngoko ke ukuxhathisa ukubola kwayo kungcono kakhulu kune-zinc plating.I-Hot-dip zinc inokumelana nokugqwala okuhle, ukukhuselwa kombingelelo kwi-substrates yentsimbi, ukumelana nemozulu ephezulu, kunye nokumelana nokhukuliseko lwamanzi etyuwa.Ifanelekile kwizityalo zekhemikhali, iindawo zokucoca kunye namaqonga okusebenza onxweme kunye nonxweme.

I-DIN (2)


  • Ngaphambili:
  • Okulandelayo:

  • Bhala umyalezo wakho apha kwaye uwuthumele kuthi